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Area Array Packaging Processes: for BGA, Flip Chip, and CSP 14.0%OFF

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

by Ken Gilleo

  • ISBN

    :  

    9780071428293

  • Publisher

    :  

    McGraw-Hill Professional

  • Subject

    :  

    Education, Technology, Engineering, Agriculture

  • Binding

    :  

    HARDCOVER

  • Pages

    :  

    259

  • Year

    :  

    2003

₹

11046.0

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₹

9499.0

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  • Description

    This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

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